整體型切割砂輪是由金剛石或立方氮化 硼（CBN），通過(guò)樹(shù)脂結(jié)合劑結(jié)合，在特殊工藝 條件下制作而成。 樹(shù)脂整體型切割砂輪主要用于半導(dǎo)體封裝材 料、光學(xué)玻璃、石英玻璃、陶瓷材料等精密元器 件的精密切割與開(kāi)槽。
Product overview Resin bond dicing blades without steel core is mainly used for precision cutting and slotting for semiconductor, optical glass, quartz glass, ceramics and son on.
整體型切割砂輪內(nèi)外采用同一種材料制作，厚 度較薄，精度高，多用于高精度、小切深的切槽和 切斷。型號(hào)分為 1A8/1 和 1A8/2 型。
組刀切割，大幅度提高切割效率 砂輪外圓消耗及工件切割品質(zhì)一致性佳 配方豐富，可滿足對(duì)不同材料的切割需求 先進(jìn)的機(jī)加工與裝配調(diào)試工藝保證組刀尺 寸、形位高精度
主要應(yīng)用于光學(xué)玻璃、石英、玻璃管、陶瓷、寶石、 陶瓷套管、磁性材料、工具鋼、軸承鋼、硬質(zhì)合金、 電子元件等的高效切斷或切槽。
主要特點(diǎn)：
主要應(yīng)用領(lǐng)域
Main features Gang saw cutting could improve efficiency The consumption of cylindrical and the cutting quality is good Various formulas can meet different cutting requirements for various materials. Advanced machining and processing ensure the size and shape and position accuracy
Application Mainly used for cutting off and slotting optical glass, quartz, glass tube, ceramic, gems, ceramic pipes, magnetic materials, tool steel, bearing steel, carbide, electronic component and so on.
Specification Z1A8、Z1A1、Z1A1R
輪轂型電鍍超薄切割砂輪 用于半導(dǎo)體集成電路及分立器 件制造過(guò)程中的開(kāi)槽、切割、 劃片，主要切割材料有硅片、 砷化鎵、玻璃、陶瓷、石英、 半導(dǎo)體復(fù)合材料等。該產(chǎn)品精 度高、壽命長(zhǎng)，性能達(dá)到國(guó)外 同類(lèi)產(chǎn)品水平。
Electroplated bond blades with hub are used to groove, cut, and dice silicon, GaAs, glass, ceramic, quartz and compound semico
nductor material wafer in integrated chips and discrete devices production. This product has high precision and long life span. Its performance has achieved abroad advanced level.
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