鋁絲劈刀

         

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 在半導體生產(chǎn)中，鍵合是一個關鍵的步驟。由于超過60%的生產(chǎn)成本產(chǎn)生線焊接之前，產(chǎn)量損失在這個階段是急迫解決的一個重要問題。在鍵合這個重要的過程，必須采用優(yōu)異的楔形工具和質(zhì)量保證技術獲得一個令人滿意的產(chǎn)品。

在集成電路的連接器,電線和工具,焊接工具扮演著重要的角色，致力于實現(xiàn)一個穩(wěn)定的、可靠的和可再生的過程。

楔形鍵合過程中是一種常見的互連技術等互連方法如球焊(使用毛細血管),標簽,倒裝芯片等。

銘灃的鋁絲劈刀產(chǎn)品代理的以色列MPP（Micro Point Pro）的Wire Bonding Wedges系列產(chǎn)品。

Wedge for Fine Pitch application

The 4WF wedges model are designed for Fine Pitch applications, usually performed on automatic machines.

They feature the full range of dimensions that appear in common wedges, but in addition they include a VSR (Vertical Side Relief) to avoid wedge interference with the adjacent wires. The 4WF model has an oval hole and 30°, 45° or 60? feed angles to allow for smaller wire pitch. When using gold wires, a cross groove is used and TiC material is recommended.

To improve wire placement control in Fine Pitch gold wire applications, a combined concave and cross groove foot design is recommended.
     

A variety of standard finished tips are also available for this model.

Wedge for Standard Automatic Bonding

The 4WA wedges model are designed to fit the majority of common applications as well as most of the automatic wedge bonders employed in the industry. The standard wedge features a full range of feed angles to cover a wide spectrum of automatic wedge bonding requirements.

A number of standard features are available for this model, such as:

• Concave for Aluminum wire application
• CBR feature to strengthen the heel area of the 1st bond
• CG(Cross Groove) for Gold wire applications