微孔陶瓷工作盤是各種半導體片生產過程中用于吸附及承載的專用工 具，應用于減薄、劃片、清洗、搬運等工序。我公司生產的工作盤可以和日本、 德國、以色列、美國及國產的設備配套使用，具有優(yōu)越的性能價格比。 Fine-pore ceramic chuck tables are mainly used to support and chuck the semico
nductor wafer when grinding and dicing. It is applied in the processes of thinning, dicing, cleaning, transportation and so on. These products which have high cost performance produced by our institute can match with the machines made in Japan, Germany, Israel, America and China.
加工對象：2、3、4、5、6、8、12 英寸半導體片 配套機床：減薄機、劃片機、清洗機等 吸盤類型：微孔陶瓷 Workpiece processed: 2,3,4,5,6,8,12 inches semiconductor wafer Suitable devices: Wafer grinder, dicing machine and cleaning machine ,etc Chuck type: Fine-pore ceramic
主要特點： 平面度、平行度高 / 組織致密均勻，強度高、通透 性好，吸附力均勻 / 易于修整 Main features High flatness and parallelism/Compact and uniform microstructure with high strength/Good permeability and uniform adsorption affinity / Dressing easily
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